View BD3570YFP-M_8181289.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

datashee t product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 tsz22111 ? 14 ? 001 www.rohm.com single-output ldo regulators high voltage ldo regulators bd357xyfp-m bd357xyhfp-m series general description bd357xyfp-m bd357xyhfp-m series regulators feature a hi gh withstand voltage (50 v) and are suitable to use with onboard vehicle microcontrollers. they offer an output current of 500 ma while limiting the quiescent current to 30 a (typ). with these devices, a ceramic capacitor ma y be used at the output for stable operation. the output to lerance is within 2 % over their operating temperature range (-40 c to +125 c). the short circuit protection is folded-type to minimize generation of heat during malfunction. thes e devices are developed to offer the most robust power supply design under harsh automotive environments. the bd357xyfp-m bd357xyhfp-m series provide an ideal solution to lower current consumption as well as to simplify the use with battery direct-coupled systems. features ? low-saturation voltage type p-channel dmos output transistors ? high output voltage precision: 2 % (lo = 200 ma) ? low-esr ceramic capacitors can be used as output capacitors. ? v cc power supply voltage = 50 v ? built-in overcurrent protection circuit and thermal shutdown circuit key specifications ? recommended v cc power supply voltage: 36 v (max) ? output voltage type: fixed / variable ? output current: 500 ma (max) ? low quiescent current: 30 a (typ) ? operating temperature range: -40 c to +125 c applications onboard vehicle devices (body control, car stereos, satellite navigation systems, etc.) packages w (typ) x d (typ) x h (max) ordering information b d 3 5 7 x y x f p - m x x part number package fp: to252-3 / 5 hfp: hrp5 packaging and forming specification e2: embossed tape and reel (to252-3 / 5) tr: embossed tape and reel (hrp5) lineup output voltage switch package orderable part number 3.3 v not included to252-3 reel of 2000 BD3570YFP-Me2 hrp5 bd3570yhfp-mtr 5.0 v to252-3 reel of 2000 bd3571yfp-me2 hrp5 bd3571yhfp-mtr variable to252-5 reel of 2000 bd3572yfp-me2 hrp5 bd3572yhfp-mtr 3.3 v included to252-5 reel of 2000 bd3573yfp-me2 hrp5 bd3573yhfp-mtr 5.0 v to252-5 reel of 2000 bd3574yfp-me2 hrp5 bd3574yhfp-mtr variable to252-5 reel of 2000 bd3575yfp-me2 hrp5 bd3575yhfp-mtr to252-5 6.50 mm x 9.50 mm x 2.50 mm to252-3 6.50 mm x 9.50 mm x 2.50 mm hrp5 9.395mm x 10.540mm x 2.005mm
datasheet datasheet 2/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series typical application circuits block diagrams / pin configurations / pin descriptions [to252-3] pin no. pin name function 1 vcc power supply pin 2 n.c. n.c. pin 3 vo voltage output pin fin gnd gnd pin (top view) 1 2 3 n.c. gnd vcc vref ocp tsd vo 1 2 3 (note 1) for fixed voltage regulator only (note 2) for adjustable voltage regulator only gnd vcc vref ocp tsd vo fin 1 n.c. 2 3 cin figure 1. to252-3 co gnd vref ocp tsd vo 5 co 4 fin sw 2 adj (n.c. (n ote 1) ) figure 3. hrp5 vcc 1 cin 3 (note1 (note2) figure 2. to252-5 vo co gnd vcc vref ocp tsd 1 5 cin 4 (note1) (note2) 2 sw 3 n.c. adj (n.c. (n o t e 1) ) fin
datasheet datasheet 3/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series block diagrams / pin configurations / pin descriptions ? continued [to252-5] pin no. pin name function 1 vcc power supply pin 2 sw n.c. vo on / off function pin n.c. pin (bd3572y only) 3 n.c. n.c. pin 4 n.c. adj n.c. pin output voltage setting pin (bd3572y, 3575y only) 5 vo voltage output pin fin gnd gnd pin [hrp5] pin no. pin name function 1 vcc power supply pin 2 sw n.c. vo on / off function pin n.c. pin (bd3570y, 3571y, 3572y only) 3 gnd gnd pin 4 n.c. adj n.c. pin output voltage setting pin (bd3572y, 3575y only) 5 vo voltage output pin fin gnd gnd pin (note 3) for fixed voltage regulator only (note 4) for adjustable voltage regulator only (note 5) for fixed voltage regulator only (note 6) for adjustable voltage regulator only gnd vref ocp tsd vo 5 4 sw 2 (note 5) ( note 6 ) vcc 1 3 a dj (n.c. (n o t e 5) ) vo gnd vcc vref ocp tsd 1 (note 3) (note 4) sw n.c. 2 3 4 5 (top view) 1 2 3 4 5 ( top view ) 1 2 3 4 5 a dj ( n.c. (n o t e 3) )
datasheet datasheet 4/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series absolute maximum ratings (ta = 25 c) parameter symbol limit unit supply voltage v cc 50 (note 7) v switch supply voltage v sw 50 (note 8) v output current i o 500 ma power dissipation pd 1.20 (to252-3) (note 9) w 1.30 (to252-5) (note 10) 1.60 (hrp5) (note 11) operating temperature rang e topr -40 to +125 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax 150 c (note 7) not to exceed pd and aso. (note 8) for on / off sw regulator only (note 9) to252-3: reduced by 9.6 mw / c at 25 c, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm). (note 10) to252-5: reduced by 10.4 mw / c at 25 c , when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm). (note 11) hrp5: reduced by 12.8 mw / c at 25 c, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm). caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. ther efore, it is important to consider circui t protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol min max unit input voltage bd3570y, 3572y, 3573y, 3575y v cc 4.5 (note 12) 36.0 v bd3571y, 3574y v cc 5.5 (note 12) 36.0 v output current i o - 500 ma variable output voltage range v o 2.8 12 v (note 12) please consider that the output voltage would decrease (dropout voltage) according to the output current. electrical characteristics unless otherwise specified, ta = -40 c to +125 c, v cc = 13.2 v, sw = 3 v (note 13) , v o settings is 5 v (note 14) parameter symbol limit unit conditions min typ max shut down current (note 13) lshut - - 10 a sw = gnd bias current lb - 30 50 a i o = 0 ma output voltage v o v o x 0.98 v o v o x 1.02 v i o = 200 ma, v o : please refer to product line. adj terminal voltage (note 14) v adj 1.235 1.260 1.285 v i o = 200 ma output current i o 0.5 - - a dropout voltage vd - 0.25 0.48 v v cc = 4.75 v, l o = 200 ma (note 15) ripple rejection r.r. 45 55 - db f = 120 hz, ein = 1 vrms, i o = 100 ma line regulation reg.i - 10 30 mv v ccd (note 16) v cc 25 v i o = 0 ma load regulation reg.l - 20 40 mv 0 ma i o 200 ma switch threshold voltage h (note 13) swh 2.0 - - v i o = 0 ma switch threshold voltage l (note 13) swl - - 0.5 v i o = 0 ma switch bias current (note 13) swi - 22 60 a sw = 5 v, l o = 0 ma (note 13) bd3573y, 3574y, 3575y only (note 14) bd3572y, 3575y only (note 15) bd3571y, 3572y, 3574y, 3575y only (note 16) bd3570y, 3573y: v ccd = 5.5 v (note 16) bd3571y, 3572y, 3574y, 3575y: v ccd = 6.5 v
datasheet datasheet 5/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series typical performance curves bd3574yhfp-m unless otherwise specified, ta = 25 c, v cc = 13.2 v, sw = 3 v) figure 4. circuit current vs supply voltage (?total supply current?) figure 5. output voltage vs supply voltage figure 6. output voltage vs output current 0 1 2 3 4 5 6 0 5 10 15 20 25 output voltage: v o [v] supply voltage: v cc [v] ta = 125 c ta = 25 c ta = -40 c 0 10 20 30 40 50 0 5 10 15 20 25 circuit current: i cc [ a] supply voltage: v cc [v] ta = 125 c ta = 25 c ta = -40 c ta = 125 c 0 1 2 3 0 100 200 300 400 500 dropout voltage: vd [v] output current: i o [m a] ta = -40 c ta = 125 c ta = 25 c ta = -40 c 0 1 2 3 4 5 6 0 500 1000 1500 2000 output voltage: v o [v] output current: i o [m a] ta = 25 c ta = 125 c ta = -40 c figure 7. dropout voltage vs output current
datasheet datasheet 6/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series typical performance curves ? continued bd3574yhfp-m unless otherwise specified, ta = 25 c, v cc = 13.2 v, sw = 3 v) figure 9. output voltage vs sw supply voltage figure 8. ripple rejection vs frequency figure 10. circuit current vs output current (?total supply current classified by load?) figure 11. output voltage vs ambient temperature (?thermal shutdown circuit ?) 0 10 20 30 40 50 60 70 10 100 1000 10000 100000 1000000 ripple rejection: r.r. [db] frequency: f [hz] ta = 25 c ta = 125 c ta = -40 c 0 1 2 3 4 5 6 00.511.52 output voltage: v o [v] sw supply voltage: v sw [v] ta = -40 c ta = 25 c ta = 125 c 0 1 2 3 4 5 6 100 120 140 160 180 200 output voltage: v o [v] ambient temperature: t a [ ? ] 0 20 40 60 80 100 0 100 200 300 400 500 circuit current: i cc [ a] output current: i o [m a]
datasheet datasheet 7/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series typical performance curves ? continued bd3574yhfp-m unless otherwise specified, ta = 25 c, v cc = 13.2 v, sw = 3 v) figure 13. sw bias current vs supply voltage figure 15. circuit current vs ambient temperature (?total supply current temperature?) figure 14. dropout voltage vs ambient temperature (i o = 500 ma) figure 12. output voltage vs ambient temperature 0 30 60 90 120 0 5 10 15 20 25 sw bias current: i sw [ a] sw supply voltage: v sw [v] ta = 125 c ta = 25 c ta = -40 c 4.5 4.75 5 5.25 5.5 -40 0 40 80 120 output voltage: v o [v] ambient temperature: t a [ ?] 0 0.5 1 1.5 2 -40 0 40 80 120 dropout voltage: vd [v] ambient temperature: t a [ ?] 0 10 20 30 40 50 -40 0 40 80 120 circuit current: i cc [ a] ambient temperature: t a [ ?]
datasheet datasheet 8/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series i/o equivalence circuit (all resistance values are typical.) output voltage adjustment to set the output voltage, insert a pull-down resistor r1 between the adj and gnd pins, and the pull-up resistor r2 between the vo and adj pins. 1 2 /1 1.26 } where: v adj is the adj terminal voltage. the recommended resistor value for the adj - gnd connection is 30 k ? to 150 k ? . adj vo r2 r1 figure 19 figure 16. 2pin [sw] figure 17. 5pin [vo] (bd3570y, 3571y, 3573y, 3574y) figure 18. 4, 5pin [adj, vo] (bd3572y, bd3575y) adj vo v cc
datasheet datasheet 9/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series power dissipation refer to the heat mitigation characteristics illustrated in fi gure 20, 21 and 22 when using the ic in an environment where ta 25 c. the characteristics of the ic are gr eatly influenced by the operating temperature. if the temperature is in excess of the maximum junction temperature tjmax, the elements of the ic may be deteriorated or be damaged. it is necessary to give sufficient consideration to the heat of the ic in view of two points, i.e., the pr otection of the ic from instantaneous damage and the maintenance of the reliability of the ic in long-time operation. in order to protect the ic from thermal destruction, it is necessary to operate t he ic in temperatures not exceeding the maximum junction temperature tjmax. figure 20 illustrates t he power dissipation/heat mitigat ion characteristics for the to252-3 package. operate the ic within the power dissipation (pd) capabilities. the following method is used to calculate the power consumption p c (w). where: v cc is the input voltage. v o is the output voltage. i o is the load current. i cc is the total supply current. pd is the power dissipation. the load current i o is obtained to operate the ic within its power dissipation capacity. (for more information about i cc , see figure 15.) the maximum load current iomax for the applied voltage v cc can be calculated during the thermal design process. 0 0.4 1.2 w 0 0.8 1.2 1.6 2.0 25 50 75 100 125 150 ic mounted on a rohm standard board substrate size: 70 mm x 70 mm x 1.6 mm ja = 104.2 (c / w) ambient temperature: ta [c] power dissipation: pd [w] to252-3 figure 20 0 0.4 1.3w 0 0.8 1.2 1.6 2.0 25 50 75 100 125 150 ambient temperature: ta [c] power dissipation: pd [w] ic mounted on a rohm standard board substrate size: 70 mm x 70 mm x 1.6 mm ja = 96.2 (c / w) to252-5 figure 21 0 0.4 1.6 w 0 0.8 1.2 1.6 2.0 25 50 75 100 125 150 ic mounted on a rohm standard board substrate size: 70 mm x 70 mm x 1.6 mm ja = 78.1 (c / w) ambient temperature: ta [c] power dissipation: pd [w] hrp5 figure 22
datasheet datasheet 10/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series calculation example example: bd3571yfp-m v cc = 12 v and v o = 5 v at ta = 85 c ? 0.624 12 12 5 ? ? 89 30a ? where: i cc is the total supply current. ? make a thermal calculation considering t he above situation so that the whole oper ating temperature range will be within the power dissipation capacity of the ic. the power consumption (pc) of the ic in the event of shorting (i.e., if the v o and gnd pins are shorted) will be obtained from the following equation. where: ishort is the short current. peripheral settings for pins and precautions 1. vcc pin insert capacitors with a capacitance from 0.33 f to 1000 f between the vcc and gnd pins. the capacitance varies with the application. be sure to design the capacitance with a sufficient margin. 2. capacitors for stopping oscillation on output pins capacitors for stopping oscillations must be placed between each output pin and the gnd pin. use a capacitor within the capacitance range of 0.1 f and 1000 f. since oscillat ions do not occur even for esr values from 0.001 ? to 100 ? , a ceramic capacitor can be used. abrupt input voltage and load fl uctuations can affect output voltages. output capacitor capacitance values should be determined after suff icient testing of the actual application. ja = 104.2 c / w -9.6 mw / c 25 c = 1.2 w 85 c = 0.624 w
datasheet datasheet 11/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prev ent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage fr om static discharge, ground the ic during a ssembly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. unused input terminals input terminals of an ic are often con nected to the gate of a mo s transistor. the gate has extremely high impedance and extremely low capacitance. if left uncon nected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line.
datasheet datasheet 12/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series operational notes ? continued 11. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adj acent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction o perates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lowe r than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. 12. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 13. area of safe operation (aso) operate the ic such that t he output voltage, output current, and power dissipation are all within the area of safe operation (aso). 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automat ically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 15. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transit ioning of the protection circuit. 16. rapid variation in vcc voltage and load current in case of a rapidly changing input volt age, transients in the output voltage might occur due to the use of a mosfet as output transistor. although the actual application might be the cause of the tr ansients, the ic i nput voltage, output current and temperature are also possible causes. in case problems arise within the ac tual operating range, use countermeasures such as adju sting the output capacitance. 17. minute variation in output voltage in case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and load current, etc., use countermeasur es such as implementing filters. nn p + p nn p + p substrate gnd n p + nn p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b bc e parasitic elements gnd parasitic elements c b e transistor (npn) resistor n region close-by parasitic elements
datasheet datasheet 13/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series marking diagrams part number marking package part number bd3570y to252-3 reel of 2000 BD3570YFP-Me2 bd3570yhfp hrp5 bd3570yhfp-mtr bd3571y to252-3 reel of 2000 bd3571yfp-me2 bd3571yhfp hrp5 bd3571yhfp-mtr bd3572y to252-5 reel of 2000 bd3572yfp-me2 bd3572yhfp hrp5 bd3572yhfp-mtr bd3573y to252-5 reel of 2000 bd3573yfp-me2 bd3573yhfp hrp5 bd3573yhfp-mtr bd3574y to252-5 reel of 2000 bd3574yfp-me2 bd3574yhfp hrp5 bd3574yhfp-mtr bd3575y to252-5 reel of 2000 bd3575yfp-me2 bd3575yhfp hrp5 bd3575yhfp-mtr to252-3 (top view) part number marking lot number to252-5 (top view) part number marking lot number hrp5 (top view) part number marking lot number 1pin mark
datasheet datasheet 14/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series physical dimension, tape and reel information package name to252-3
datasheet datasheet 15/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series physical dimension, tape and reel information package name to252-5
datasheet datasheet 16/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series physical dimension, tape and reel information package name hrp5
datasheet datasheet 17/17 tsz02201-0t2t0an00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 19.sep.2013 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bd357xyfp-m bd357xyhfp-m series revision history date revision changes 20.aug.2013 001 new release 19.sep.2013 002 product name is revised.
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

▲Up To Search▲

Price & Availability of BD3570YFP-M

	To Download BD3570YFP-M Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .